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VSC8221 Datasheet(PDF) 124 Page - Microsemi Corporation |
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VSC8221 Datasheet(HTML) 124 Page - Microsemi Corporation |
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124 / 138 page ![]() VSC8221 Data Sheet VMDS-10106 Revision 4.1 December 2006 124 of 124 124 29 PACKAGING SPECIFICATIONS 29.1 100-Ball 9 × 9mm TFBGA Mechanical Specification Figure 31. 100-Ball 9 × 9mm TFBGA Mechanical Specification 29.2 Package Moisture Sensitivity Moisture sensitivity level ratings for Microsemi products comply with JEDEC standard iPC/JEDEC J-STD-020B. All Microsemi products are rated moisture sensitivity level 3 or better unless specified otherwise. For more information, see the JEDEC standard. Dimensions are in millimeters (mm). Ball Pitch : 0.80 Ball Diameter: 0.4 Substrate Thickness: 0.21 Mold Thickness: 0.53 |
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