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M5M4V16169DTP Datasheet (PDF) - Mitsubishi Electric Semiconductor

M5M4V16169DTP Datasheet PDF - Mitsubishi Electric Semiconductor
No. de pieza M5M4V16169DTP
Descarga  M5M4V16169DTP Descarga

Tamaño del archivo   734.96 Kbytes
Page   64 Pages
Fabricante Electrónico  MITSUBISHI [Mitsubishi Electric Semiconductor]
Página de inicio  http://www.mitsubishichips.com
Logo MITSUBISHI - Mitsubishi Electric Semiconductor
Descripción Electrónicos 16MCDRAM:16M(1M-WORD BY 16-BIT) CACHED DRAM WITH 16K (1024-WORD BY 16-BIT) SRAM

M5M4V16169DTP Datasheet (PDF)

Go To PDF Page Descarga Datasheet
M5M4V16169DTP Datasheet PDF - Mitsubishi Electric Semiconductor

No. de pieza M5M4V16169DTP
Descarga  M5M4V16169DTP Click to download

Tamaño del archivo   734.96 Kbytes
Page   64 Pages
Fabricante Electrónico  MITSUBISHI [Mitsubishi Electric Semiconductor]
Página de inicio  http://www.mitsubishichips.com
Logo MITSUBISHI - Mitsubishi Electric Semiconductor
Descripción Electrónicos 16MCDRAM:16M(1M-WORD BY 16-BIT) CACHED DRAM WITH 16K (1024-WORD BY 16-BIT) SRAM

M5M4V16169DTP Datasheet (HTML) - Mitsubishi Electric Semiconductor

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M5M4V16169DTP Detalles de producto

DESCRIPTION
The M5M4V16169DTP/RT is a 16M-bit Cached DRAM which integrates input registers, a 1,048,576-word by 16-bit dynamic memory array and a 1024- word by 16-bit static RAM array as a Cache memory (block size 8x16) onto a single monolithic circuit. The block data transfer between the DRAM and the data transfer buffers (RB1/RB2/WB1/WB2) is performed in one instruction cycle, a fundamental advantage over a conventional DRAM/SRAM cache.
The RAM is fabricated with a high performance CMOS process, and is ideal for large-capacity memory systems where high speed, low power dissipation, and low cost are essential. The use of quadruple-layer polysilicon process combined with silicide and double layer aluminum wiring technology, a single-transistor dynamic storage stacked capacitor cell, and a six-transistor static storage cache cell provide high circuit density at reduced costs.

FEATURES
# 70-pin,400-mil TSOP (type II ) with 0.65mm lead pitch and 23.49mm package length.
# Multiplexed DRAM address inputs for reduced pin count and higher system densities.
# Selectable output operation (transparent / latched / registered) using set command register cycle.
# Single 3.3V +/- 0.3V Power Supply. (3.3V +/- 0.15V for -7 part)
# 2048 refresh cycles every 64ms (Ad0->Ad10).
# Programmable burst length (1,2,4,8) and burst sequence (sequential,interleave) with no latency.
# Synchronous design for precise control with an external clock (K).
# Output retention by advanced mask clock (CMs#).
# All inputs/outputs low capacitance and LVTTL compatible.
# Separate DRAM and SRAM address inputs for fast SRAM access.
# Page Mode capability.
# Auto Refresh capability.
# Self Refresh capability.




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