GENERAL DESCRIPTIONS The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as Concurrent Operations in Serial Flash memory for the first time. The W25M SpiStack® series is ideal for small form factor system designs, and applications that demand high Program/Erase data throughput. All W25N SpiFlash family devices are offered in space-saving packages which were impossible to use in the past for the typical NAND flash memory. FEATURES • New Family of SpiFlash Memories – W25M02GW: 2x1G-bit / 2x128M-Byte – Standard SPI: CLK, /CS, DI, DO, /WP, /HOLD – Dual SPI: CLK, /CS, IO0, IO1, /WP, /HOLD – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Compatible SPI serial flash commands • Highest Performance Serial NAND Flash – 104MHz Standard/Dual/Quad SPI clocks – 208/416MHz equivalent Dual/Quad SPI – 40MB/S continuous data transfer rate – Fast Program/Erase performance – More than 100,000 erase/program cycles – More than 10-year data retention • Efficient “Continuous Read Mode”(1) – Alternative method to the Buffer Read Mode – No need to issue “Page Data Read” between Read commands – Allows direct read access to the entire array • Flexible “Concurrent Operations” – Independent single die access – Allows “Read while Program/Erase” – Allows “Multi Die Program/Erase” – Improves Program/Erase throughput • Low Power, Wide Temperature Range – Single 1.70 to 1.95V supply – 25mA active, 20µA standby current – -40°C to +85°C operating range • Flexible Architecture with 128KB blocks – Uniform 128K-Byte Block Erase – Flexible page data load methods • Advanced Features – On chip 1-Bit ECC for memory array – ECC status bits indicate ECC results – bad block management and LUT(2) access – Software and Hardware Write-Protect – Power Supply Lock-Down and OTP protection – 2KB Unique ID and 2KB parameter pages – Ten 2KB OTP pages(3) • Space Efficient Packaging – 8-pad WSON 8x6-mm – 24-ball TFBGA 8x6-mm – Contact Winbond for other package options
|